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High-purity microcrystalline HA4-Z series powder
Classification:
High purity low temperature sintered alumina granulation powder series
E-mail:
Details
Product Characteristics:
The granulated powder has high purity, large bulk density, excellent sphericity, uniform particle distribution, good fluidity, and is easy to form and demold by dry pressing. The green body has high density and strong bonding force. It exhibits excellent low-temperature firing performance, resulting in small crystal nucleus size, low porosity, high ceramic density, and low shrinkage rate after firing, with superior structural and mechanical properties.
Model parameters:
|
product model |
unit |
JCM-HA4-Z18 |
JCM-HA4-Z25 |
JCM-HA4-Z35 |
JCM-HA4-Z45 |
|
|
purity |
% |
≥99.99 |
||||
|
impurity |
Na |
ppm |
<10 |
|||
|
Fe |
ppm |
<10 |
||||
|
Si |
ppm |
<20 |
||||
|
Ca |
ppm |
<10 |
||||
|
K |
ppm |
<10 |
||||
|
Mg |
ppm |
<10 |
||||
|
apparent density |
g/cm3 |
0.9±0.1 |
||||
|
Forming density(150MPa) |
g/cm3 |
2.2±0.02 |
||||
|
shrinkage rate |
% |
18.5±0.5 |
||||
|
Particle size of granulation powder d50 |
μm |
60±5 |
||||
|
mean grain size d50 |
μm |
0.175±0.01 |
0.250±0.01 |
0.350±0.01 |
0.450±0.01 |
|
|
firing temperature |
℃ |
1350±20 |
1400±20 |
1470±20 |
1550±20 |
|
|
Firing density |
g/cm3 |
3.93±0.01 |
3.93±0.01 |
3.94±0.01 |
3.95±0.01 |
|
Application Fields:
Crystalline materials: transparent ceramics (high-speed rail and airplane windshields) ruby, sapphire LED substrates, YAG crystals, etc; and
Optical materials: translucent body, fluorescent body, etc.; and
Bio-ceramics: human bones, teeth, etc.; and
High-purity, high-functioning materials: precision components, insulators (lithium battery diaphragm), ceramic capacitors, etc.; high strength, corrosion-resistant materials: precision components, insulators (lithium battery diaphragm), ceramic capacitors, etc.
High-strength corrosion-resistant materials: defense and military fields, such as armored tanks, bulletproof vests, wave-transparent missile radomes, etc.
Strong wear-resistant materials: cutting tools, grinding tools, grinding balls, etc.; and
Electronic materials: IC substrate, ultra-smooth substrate, etc.
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