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Hongcheng New Materials attended the Power Semiconductor Advanced Packaging Forum and TGV Glass Through-Hole Technology Application Conference
Release time:
2026-07-21
Henan Hongcheng New Materials Technology Co., Ltd. and its subsidiary Jingci (Chengdu) New Materials Technology Co., Ltd. are focusing on the 2026 3rd Power Semiconductor Advanced Packaging Forum and TGV Glass Through-Hole Technology Application Conference, as well as the 2026 Advanced Ceramic Technology and Industrial Chain Innovation and Development Conference. At the exhibition site, we engaged in in-depth exchanges with upstream and downstream enterprises and research institutions through sample displays, parameter comparisons, and application case presentations, jointly exploring the performance of powders and process optimization. Based on powder and quality, Henan Hongcheng New Materials Technology Co., Ltd. continuously provides stable and reliable powder support for the chemical industry, electronic ceramics, biomedicine and other fields, relying on its large-scale production lines, strict quality control and rapid response capabilities.
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